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added missing 3D Models

master
Benjamin 3 年之前
父節點
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85024683a8
共有 5 個檔案被更改,包括 149671 行新增0 行删除
  1. +9949
    -0
      3d models/FFC3B05-04-T.stp
  2. +85999
    -0
      3d models/FPC-40.stp
  3. +16979
    -0
      3d models/HRO_TYPE-C-31-M-12 (1).step
  4. +36719
    -0
      3d models/Poti SMD 5k Bi Technologies 23AR5KLFTR.stp
  5. +25
    -0
      rgb_lcd_pihat.kicad_pcb

+ 9949
- 0
3d models/FFC3B05-04-T.stp
文件差異過大導致無法顯示
查看文件


+ 85999
- 0
3d models/FPC-40.stp
文件差異過大導致無法顯示
查看文件


+ 16979
- 0
3d models/HRO_TYPE-C-31-M-12 (1).step
文件差異過大導致無法顯示
查看文件


+ 36719
- 0
3d models/Poti SMD 5k Bi Technologies 23AR5KLFTR.stp
文件差異過大導致無法顯示
查看文件


+ 25
- 0
rgb_lcd_pihat.kicad_pcb 查看文件

@@ -745,6 +745,11 @@
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
(model "${KIPRJMOD}/3d models/HRO_TYPE-C-31-M-12 (1).step"
(offset (xyz -4.5 -5 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)

(module Custom_logo:BB (layer F.Cu) (tedit 0) (tstamp 6031AC19)
@@ -1842,6 +1847,11 @@
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
(model "${KIPRJMOD}/3d models/L1_coil.step"
(offset (xyz 3 -3 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)

(module Capacitor_SMD:C_0603_1608Metric_Pad1.05x0.95mm_HandSolder (layer B.Cu) (tedit 5B301BBE) (tstamp 602FE1C2)
@@ -2218,6 +2228,11 @@
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
(model "${KIPRJMOD}/3d models/FFC3B05-04-T.stp"
(offset (xyz 0 -5 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)

(module Connector_FFC-FPC:Hirose_FH12-40S-0.5SH_1x40-1MP_P0.50mm_Horizontal (layer F.Cu) (tedit 5D24667B) (tstamp 602FE3C3)
@@ -2350,6 +2365,11 @@
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
(model "${KIPRJMOD}/3d models/FPC-40.stp"
(offset (xyz -9.75 1.5 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)

(module Inductor_SMD:L_6.3x6.3_H3 (layer B.Cu) (tedit 5990349C) (tstamp 602FE3DC)
@@ -2661,6 +2681,11 @@
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
(model "${KIPRJMOD}/3d models/Poti SMD 5k Bi Technologies 23AR5KLFTR.stp"
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 -90))
)
)

(module Button_Switch_SMD:SW_SPDT_PCM12 (layer F.Cu) (tedit 5A02FC95) (tstamp 602FE506)


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